Head of Semiconductor Manufacturing
Kforce Inc.

Job Info

---

RESPONSIBILITIES:

A Kforce client is seeking to hire a Head of Semiconductor Manufacturing in Chandler, Arizona (AZ).Summary:The client is a growing technology company in the Semiconductor industry is seeking a Head of Semiconductor Manufacturing. We are working directly with the Hiring Manager on this search assignment. This position includes cross functional management and direct customer interactions for new product development, qualification, and mass production. The position is hybrid remote; And is interfacing with sales, finance, engineering, and business analysis.Responsibilities include:

• Streamline the company's IC package technologies directly to new and existing customers to find potential applications
• Head of Semiconductor Manufacturing will create detailed package/process risk assessments for the manufacturability and reliability of NPIs, including highlighting areas of customer requirements that drive cost
• Conducting statistical analyses of cost and factory data to identify areas of optimization
• Head of Semiconductor Manufacturing will work closely with customer package engineering and factory engineering to understand/characterize prototype build plans; Enabling successful qualifications and robust, on-time manufacturing production
• Create and maintain detailed cost analysis on package types, process flows, and customer product RFQs as well as provide detailed pricing inputs to Management and Sales

REQUIREMENTS:

• Bachelor's degree in Engineering; Master's degree preferred
• 12+ years of experience in semiconductor manufacturing or packaging
• Exhibit organized technical Project Management experience (preferably, involving offshore factories) and the ability to multiplex across numerous programs and teams is essential
• Demonstrated ability to work independently in a heavily matrixed organization; needs to be self-driven and very motivated to adapt and overcome obstacles across a multi-faceted job role; Assuming ownership of program success is a must
• Solid knowledge of semiconductor packaging design, materials, substrates, manufacturing methods, and various wafer bumping
• Hands on semiconductor manufacturing / technical experience with wafer level packaging and/or die processing
• Previous experience in a customer facing business role
• Proven track record of driving customer review increases year over year
• Solid background and knowledge of statistical analysis
• Requires excellent written and verbal communication skills
• Frequent face to face and teleconference technical presentations to customers is required
• Proficiency with Microsoft Office (Excel, PowerPoint, Outlook) is required
• This position requires approximately 15% domestic and 15% international travel

Preferred Qualifications:

• 6 Sigma black or green belt highly desired
• Knowledge of material and package characterization data analysis, reliability test methods, and qualification procedures are desired
• Fluency in the Korean or Chinese language is beneficial

This job has expired.